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Fong Yong Chemical Co., Ltd.
 
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Fong Yong Chemical Co., Ltd.
[Taiwan]
Address:
2nd Floor, No.216-2 Chung Chang Rd. Su Lin City Taipei Hsein 238 Taiwan
Phone:
886-2-26824939
Contact name:
Catherine Lee , Sales
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Fong Yong Chemical Co., Ltd.



 
Potting compounds / Encapsulation : epoxy, silicone, PU (polyurethane)

potting/encapsulation/casting/insulation

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 Model Number UL-94 system
 Brand Name FongYong

  • EPOXY SYSTEM
    Part No. mixting ratio Color Viscosity (CPS,25C) Features & Applications
    E-532A/ H-532B 100:15 curtomize 9,000 / 100 Features:UL94V0 listed, low shrinkage good electrical properties, chemical resistance & water proofing, excellent thermal conductivity

    Application:Electrical & electronic components potting and casting

    E-536/ H-536 3:1 customize 42,000 / 160 Features:UL94V0 listed, good electrical properties, long pot-life, low shrinkage, strong bonding strength, excellent thermal conductivity, chemical & water resistance, high heat distortion temperature

    Applications:Large size of electrical & electronic components potting and casting

    E-537/ H-537 100:10 customize paste / 1,500 Features:UL94V0 listed, good electrical properties, long pot-life, excellent thermal conductivity, chemical & water resistance, high heat istortion temperature

    Applications:Small size of electrical & electronic components potting and casting

    E-759/ H- 759 100:30 Black 3,800 / 180 Features:UL94V0 listed, flexible and low shrinkage, excellent thermal & mechanical shock resistance, excellent chemical & water resistance

    Applications:Delicate electrical & electronic components potting, casting & encapsulating

  • * * *
  • SILICONE SYSTEM
    Part No. mixting ratio Color Viscosity (CPS,25C) Features & Applications
    SFY-161 1:1 gray 12,200 / 5900 Room temperature cured or heat cured

    Stability over wide temperature range �50 to 200 degree C

    Mainly designed fro electrical and electronic potting and encapsulation used.

    SFY-171 1:1 black 4,500 / 2,250 Room temperature cured or heat cured

    Stability over wide temperature range �50 to 200 degree C

    Mainly designed fro electrical and electronic potting and encapsulation used.




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